3DIC Compiler Description
The Synopsys 3DIC Compiler, which is founded on the premier digital implementation platform in the industry and leverages a unified fusion data model, facilitates a smooth transition to 2.5/3D heterogeneous integration. This comprehensive platform supports analysis-driven feasibility studies, multi-die partitioning, and the selection of foundry technology for both prototyping and floor planning in a single environment. As a result, it promotes effective design implementation that encompasses advanced packaging and die-to-die routing, coupled with golden signoff verification. Additionally, the 3DIC Compiler collaborates with Synopsys 3DSO.ai, the first autonomous AI optimization solution in the market for multi-die designs, enhancing system performance and ensuring quality outcomes regarding thermal integrity, signal integrity, and power network design. Widely embraced by clients, the 3DIC Compiler platform has also received certification from prominent foundries, validating its capabilities in advanced process and packaging technologies. This combination of features positions the 3DIC Compiler as a vital tool for engineers aiming to innovate in the realm of integrated circuit design.
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Pricing
Free Trial:
Yes
Integrations
No Integrations at this time
Company Details
Company:
Synopsys
Year Founded:
1986
Headquarters:
United States
Website:
www.synopsys.com/implementation-and-signoff/3dic-design.html
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Product Details
Platforms
Windows
Types of Training
Training Docs
Live Training (Online)
Webinars
In Person
Training Videos
Customer Support
Business Hours
Online Support
3DIC Compiler Features and Options
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